DIC Corporation is committed to providing unique solutions in the field of "electronic chemicals," focusing on the development of semiconductor packaging materials and materials for cutting-edge electronic components, for which demand is expected to continue to grow. To achieve this goal, the company announced on August 1, 2025, that it has decided to build a new epoxy resin production facility at its Chiba Plant in Ichihara City, Chiba Prefecture, Japan. This investment decision is based on the project's designation as a "stable supply guarantee plan" by the Ministry of Economy, Trade and Industry of Japan under the Economic Security Promotion Act, and is expected to receive a government subsidy of up to 3 billion yen (approximately 146 million yuan).
Epoxy resin is a highly reactive thermosetting synthetic resin with excellent moldability, heat resistance, electrical insulation, and adhesion properties, making it widely used in various industrial fields. DIC Corporation has been producing and selling epoxy resins since 1968. Leveraging its polymer-design-based development system (covering the entire process from raw materials to finished products) and decades of accumulated large-scale production capabilities, it continues to provide cutting-edge products to customers in the electronics industry. In the semiconductor manufacturing sector in particular, the company's epoxy resins offer superior heat resistance, improved dimensional stability, and reduced transmission loss, making them an indispensable key material perfectly suited to the demands of high-speed, high-capacity communications. With the surge in demand for semiconductors, ensuring a stable supply of these resins is crucial.
