Epoxy Devcon Zip Patch

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Technical Data Sheet

physical property Test ConditionTest MethodTest Result
Shrinkage rateASTMD25660.10 %
Solid content by volume100 %
Uncured PropertiesTest ConditionTest MethodTest Result
flash point149 °C
Curing Time4.0 hr
thermosettingTest ConditionTest MethodTest Result
STORAGE STABILITY5.0 min
Thermosetting mixed viscosity17000 cP
hardnessTest ConditionTest MethodTest Result
ASTMD224070
Supplementary InformationTest ConditionTest MethodTest Result
TensileShearAdhesion8.27 MPa
TensileShearAdhesion16.5 MPa
Mechanical propertiesTest ConditionTest MethodTest Result
Tensile modulusASTMD6381320 MPa
tensile strengthASTMD63868.9 MPa
elongationBreak15到25 %
bending strengthASTMD790131 MPa
Impact resistanceTest ConditionTest MethodTest Result
ImpactResistanceASTMD95063.0 kJ/m²
filmTest ConditionTest MethodTest Result
Peel strength - GBS6.1 kN/m
Electrical performanceTest ConditionTest MethodTest Result
dielectric strengthASTMD1499.8 kV/mm
Thermal performanceTest ConditionTest MethodTest Result
ASTMD6961.2E-05 cm/cm/°C
Service93 °C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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