Material Comparison
Product Info
Product Name
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Epoxy Devcon Zip Patch Devcon
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Plastic Datasheets
| Impact resistance | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Impact Strength | ASTM D950 | 63.0 kJ/m² |
| hardness | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Shore hardness | 邵氏D | ASTM D2240 | 70 |
| Supplementary Information | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Tensile shear adhesion | ABS,PVC | 8.27 MPa | |
| AL | 16.5 MPa |
| film | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Peel strength - GBS | 6.1 kN/m |
| Mechanical properties | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| tensile strength | ASTM D638 | 68.9 MPa | |
| Tensile modulus | ASTM D638 | 1320 MPa | |
| bending strength | ASTM D790 | 131 MPa | |
| elongation | 断裂 | 15to25 % |
| Electrical performance | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| dielectric strength | ASTM D149 | 9.8 kV/mm |
| Uncured Properties | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| flash point | 149 °C | ||
| Curing Time | 4.0 hr |
| thermosetting | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Thermosetting mixed viscosity | 17000 cP | ||
| STORAGE STABILITY | 5.0 min |
| physical property | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Solid content by volume | 100 % | ||
| Shrinkage rate | MD | ASTM D2566 | 0.10 % |
| Thermal performance | Test Condition | Test Method | Devcon/Devcon Zip Patch |
|---|---|---|---|
| Usage temperature | 93 °C | ||
| Linear coefficient of thermal expansion | MD | ASTM D696 | 1.2E-05 cm/cm/°C |
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