Epoxy Hysol® MG33F-0588

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Technical Data Sheet

thermosetting	Test Condition	Test Method	Test Result
shelf-life			30 wk
Post curing time			2.0 hr

physical property	Test Condition	Test Method	Test Result
density		ASTM D792	1.87 g/cm³

Mechanical properties	Test Method	Test Result
Tensile modulus	ASTM D638	7580 MPa
tensile strength	ASTM D638	100 MPa
Flexural modulus	ASTM D790	19300 MPa
bending strength	ASTM D790	141 MPa

Electrical performance	Test Condition	Test Method	Test Result
dielectric constant		ASTM D150	4.30
dielectric constant	dielectric constant		ASTM D150	4.10
Dissipation Factor		ASTM D150	4E-03
Dissipation Factor	Dissipation Factor		ASTM D150	0.018

Thermal performance	Test Condition	Test Method	Test Result
Glass Transition Temperature		DSC	170 °C
Linear coefficient of thermal expansion		ASTM D696	2E-05 cm/cm/°C
Linear coefficient of thermal expansion	Linear coefficient of thermal expansion		ASTM D696	7E-05 cm/cm/°C

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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