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Epoxy Hysol® MG33F-0588 Henkel Ablestik
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Plastic Datasheets
Electrical performance | Test Condition | Test Method | Henkel Ablestik/Hysol® MG33F-0588 |
---|---|---|---|
Dissipation Factor | 25°C,100kHz | ASTM D150 | 0.018 |
dielectric constant | 25°C,100Hz | ASTM D150 | 4.30 |
25°C,100kHz | ASTM D150 | 4.10 | |
Dissipation Factor | 25°C,100Hz | ASTM D150 | 4E-03 |
Mechanical properties | Test Condition | Test Method | Henkel Ablestik/Hysol® MG33F-0588 |
---|---|---|---|
tensile strength | ASTM D638 | 100 MPa | |
Tensile modulus | ASTM D638 | 7580 MPa | |
Flexural modulus | ASTM D790 | 19300 MPa | |
bending strength | ASTM D790 | 141 MPa |
thermosetting | Test Condition | Test Method | Henkel Ablestik/Hysol® MG33F-0588 |
---|---|---|---|
shelf-life | 10°C | 30 wk | |
Post curing time | 150°C | 2.0 hr |
physical property | Test Condition | Test Method | Henkel Ablestik/Hysol® MG33F-0588 |
---|---|---|---|
density | ASTM D792 | 1.87 g/cm³ |
Thermal performance | Test Condition | Test Method | Henkel Ablestik/Hysol® MG33F-0588 |
---|---|---|---|
Glass Transition Temperature | DSC | 170 °C | |
Linear coefficient of thermal expansion | MD:80到100°C | ASTM D696 | 2E-05 cm/cm/°C |
MD:200到240°C | ASTM D696 | 7E-05 cm/cm/°C |
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