Technical Data Sheet
Test Condition | Test Method | Test Result | |
---|---|---|---|
相对电容率 | 1MHz | IEC60250 | 2.90 |
耗散因数 | 1MHz | IEC60250 | 0.015 |
吸水率 | 平衡,23°C,50%RH | ISO62 | 1.8 % |
密度 | 23°C | ISO1183 | 1.07 g/cm³ |
熔体体积流动速率 | 220°C/10.0kg | ISO1133 | 30.0 cm³/10min |
吸水率 | 饱和,23°C | ISO62 | 6.1 % |
维卡软化温度 | ISO306/B50 | 140 °C | |
体积电阻率 | IEC60093 | 1E+13 ohms·cm | |
拉伸模量 | 23°C | ISO527-2/1 | 1900 MPa |
拉伸应力 | 屈服,23°C | ISO527-2/50 | 45.0 MPa |
拉伸应变 | 屈服,23°C | ISO527-2/50 | 3.8 % |
简支梁缺口冲击强度 | 23°C | ISO179/1eA | 14 kJ/m² |
简支梁无缺口冲击强度 | 23°C | ISO179/1eU | 无断裂 |
热变形温度 | 0.45MPa,未退火 | ISO75-2/B | 115 °C |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.
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