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PLA 4032D(粉) NATUREWORKS USA

195

Form:Granules

Properties:
Thermal stabilityHigh mobilitystandardUpdatable resourcesOil resistantBiodegradableFood contact compliance
Typical Applications:
chipLaminate
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:chip | Laminate
Properties:Thermal stability | High mobility | standard | Updatable resources | Oil resistant | Biodegradable | Food contact compliance

Certificates

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Technical Data Sheet

optical performanceTest ConditionTest MethodTest ResultTest Unit
gloss20°,25.4 μm20°,25.4 μmASTM D245790
turbidity25.4 μm25.4 μmASTM D10032.1%
impact performanceTest ConditionTest MethodTest ResultTest Unit
Impact strength of cantilever beam gapASTM D25616J/m
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Crystallization peak temperatureDSCDSC12ASTM D3418155 to 170°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
melt mass-flow rate210℃,2.16kg210℃/2.16 kgASTM D12387g/10min
Melt density230℃230℃1.08g/cm³
filmTest ConditionTest MethodTest ResultTest Unit
film thickness测试经测试25µm
Secant modulusTD,25 μmTD,25 μmASTM D8823790Mpa
Secant modulusMD,25 μmMD,25 μmASTM D8823450Mpa
tensile strengthTD,Yield,25 μmTD,Yield,25 μmASTM D882145Mpa
tensile strengthMD,Yield,25 μmMD,Yield,25 μmASTM D882103Mpa
Tensile strainTD,Break,25 μmTD,Break,25 μmASTM D882100%
Tensile strainMD,Break,25 μmMD,Break,25 μmASTM D882180%
Elmendorf tear strengthMD,25 μmMD,25 μmASTM D192217g
Elmendorf tear strengthTD,25 μmTD,25 μmASTM D192214g
Carbon dioxide transmittanceInternal Method2850cm³/m²/24 hr
Oxygen permeabilityASTM D1434675cm³/m²/24 hr
Water vapor permeabilityASTM F1249380g·mm/m²/atm/24 hr
Spencer ImpactSpencer Impact2.5J
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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