Epoxy Devcon Ceramic Repair Putty

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Technical Data Sheet

physical property Test ConditionTest MethodTest Result
density1.69 g/cm³
Specific volume0.592 cm³/g
Shrinkage rateASTMD25660.22 %
Solid content by volume100 %
thermosettingTest ConditionTest MethodTest Result
按容量计算的混合比:4.3按重量计算的混合比:7.0
按容量计算的混合比:1.0按重量计算的混合比:1.0
25 min
Uncured PropertiesTest ConditionTest MethodTest Result
Curing Time16 hr
hardnessTest ConditionTest MethodTest Result
ASTMD224090
Supplementary InformationTest ConditionTest MethodTest Result
TemperatureResistance177 °C
TemperatureResistance66 °C
TensileShearAdhesionASTMD100213.8 MPa
Mechanical propertiesTest ConditionTest MethodTest Result
Tensile modulusASTMD6386210 MPa
bending strengthASTMD79044.6 MPa
compressive strengthASTMD69587.6 MPa
Electrical performanceTest ConditionTest MethodTest Result
dielectric strengthASTMD14915 kV/mm
dielectric constantASTMD15041.0
Thermal performanceTest ConditionTest MethodTest Result
ASTMD6963.1E-05 cm/cm/°C
thermal conductivityASTMC1770.79 W/m/K
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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