Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy Devcon Ceramic Repair Putty Devcon
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Plastic Datasheets
| hardness | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| Shore hardness | 邵氏D | ASTM D2240 | 90 |
| Supplementary Information | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| Temperature resistance | Wet | 66 °C | |
| Dry | 177 °C | ||
| Tensile shear adhesion | ASTM D1002 | 13.8 MPa |
| Mechanical properties | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| compressive strength | ASTM D695 | 87.6 MPa | |
| Tensile modulus | ASTM D638 | 6210 MPa | |
| bending strength | ASTM D790 | 44.6 MPa |
| Electrical performance | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| dielectric strength | ASTM D149 | 15 kV/mm | |
| dielectric constant | ASTM D150 | 41.0 |
| thermosetting | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| Thermosetting components | 部件A | 按容量计算的混合比:4.3按重量计算的混合比:7.0 | |
| 储存稳定性(24°C) | 25 min | ||
| 部件B | 按容量计算的混合比:1.0按重量计算的混合比:1.0 |
| Uncured Properties | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| Curing Time | 16 hr |
| physical property | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| density | 1.69 g/cm³ | ||
| Specific volume | 0.592 cm³/g | ||
| Solid content by volume | 100 % | ||
| Shrinkage rate | MD | ASTM D2566 | 0.22 % |
| Thermal performance | Test Condition | Test Method | Devcon/Devcon Ceramic Repair Putty |
|---|---|---|---|
| thermal conductivity | ASTMC177 | 0.79 W/m/K | |
| Linear coefficient of thermal expansion | MD | ASTM D696 | 3.1E-05 cm/cm/°C |
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