plas
Log In

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy Devcon Ceramic Repair Putty Devcon
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--

Plastic Datasheets

Supplementary InformationTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
Temperature resistanceWet66 °C
Dry177 °C
Tensile shear adhesionASTM D100213.8 MPa
hardnessTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
Shore hardnessShoreDASTM D224090
thermal performanceTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
Linear coefficient of thermal expansionMDASTM D6963.1E-05 cm/cm/°C
thermal conductivityASTMC1770.79 W/m/K
mechanical propertiesTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
bending strengthASTM D79044.6 MPa
compressive strengthASTM D69587.6 MPa
Tensile modulusASTM D6386210 MPa
Electrical performanceTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
Dielectric constantASTM D15041.0
Dielectric strengthASTM D14915 kV/mm
Uncured PropertiesTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
Curing time16 hr
thermosettingTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
Thermosetting componentsPot Life(24°C)25 min
PartA按容量计算的混合比:4.3按重量计算的混合比:7.0
PartB按容量计算的混合比:1.0按重量计算的混合比:1.0
Physical propertiesTest ConditionTest MethodDevcon/Devcon Ceramic Repair Putty
density1.69 g/cm³
Shrinkage rateMDASTM D25660.22 %
Solid content by volume100 %
Specific volume0.592 cm³/g