PA66 A3X2G5 BK PA66 vs. - Plastic Material Properties Comparison Chart at Plas.com

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Flame retardant grade

Electrical performance	Test Condition	Test Method	BASF SHANGHAI/A3X2G5 BK
Volume resistivity	干/湿		10 Ω.cm
Dielectric strength	K20/P50，干/湿		80/65 KV/mm
Loss angle	1MHz，干/湿		0.02/0.1
Surface resistivity	干/湿		>10 Ω
Compared to the Leakage Traceability Index (CTI)	干/湿		CTI 500
Dielectric constant	1MHz，干/湿		3.7/5
mechanical properties	Test Condition	Test Method	BASF SHANGHAI/A3X2G5 BK
Impact strength of cantilever beam gap	+23℃，干/湿		11/17 KJ/m
elongation	≤0.5%, +23℃，湿		3500 Mpa
Charpy Notched Impact Strength	+23℃，干/湿		13/18 KJ/m
Elongation at Break	干/湿，V=50mm/min		3/4.5 %
Fracture stress (V=50mm/min)	干/湿		140/100 Mpa
Charpy Notched Impact Strength	30℃，干		65 KJ/m
Tensile creep modulus	1000h,湿		3500 Mpa
Tensile modulus	干/湿		8500/6000 Mpa
impact strength	干/湿		4/10 J
Ball Pressure Test	干/湿		190 Mpa
Bending modulus	干/湿		7100 Mpa
Tensile yield stress (V=50mm/min)	干/湿		140/100 Mpa
thermal performance	Test Condition	Test Method	BASF SHANGHAI/A3X2G5 BK
Temperature index	在20000h/5000h，后拉伸强度下降50%时		135/153 °C
Maximum operating temperature			220 °C
Hot deformation temperature	0.45MPa负荷，Dry		250 °C
Hot deformation temperature		1.8MPa负荷，Dry		250 °C
specific heat	Dry		1.5 J/(g.K)
Linear coefficient of thermal expansion	（23-80）℃，Dry		2.5-3.5/6-8 10
thermal conductivity	Dry		0.27 W/(m.K)

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