PA66 A3X2G5 BK BASF SHANGHAI

Form：Granules | Grade：Flame retardant grade

Properties:

Electrical performanceFlame retardantOil resistant

Typical Applications:

Bottle capPlastic coverHome appliance componentsAutomotive ApplicationsFitness equipmentElectronic and electrical components

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Product Description

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Datasheet

Product Description

Typical Applications:	Bottle cap \| Plastic cover \| Home appliance components \| Automotive Applications \| Fitness equipment \| Electronic and electrical components
Properties:	Electrical performance \| Flame retardant \| Oil resistant

Certificates

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Technical Data Sheet

mechanical properties	Test Condition	Test Method	Test Result	Test Unit
elongation	≤0.5%, +23℃，湿		3500	Mpa
Elongation at Break	干/湿，V=50mm/min		3/4.5	%
Tensile modulus	干/湿		8500/6000	Mpa
Charpy Notched Impact Strength	30℃，干		65	KJ/m
Impact strength of cantilever beam gap	+23℃，干/湿		11/17	KJ/m
Tensile yield stress (V=50mm/min)	干/湿		140/100	Mpa
Elongation at Break	干/湿，V=50mm/min		3/4.5	%
Charpy Notched Impact Strength	+23℃，干/湿		70/75	KJ/m
Tensile creep modulus	1000h,湿		3500	Mpa
impact strength	干/湿		4/10	J
Fracture stress (V=50mm/min)	干/湿		140/100	Mpa
Charpy Notched Impact Strength	+23℃，干/湿		13/18	KJ/m
Bending modulus	干/湿		7100	Mpa
Ball Pressure Test	干/湿		190	Mpa
thermal performance	Test Condition	Test Method	Test Result	Test Unit
Linear coefficient of thermal expansion	（23-80）℃，Dry		2.5-3.5/6-8	10
Hot deformation temperature	1.8MPa负荷，Dry		250	°C
Maximum operating temperature			220	°C
Hot deformation temperature	0.45MPa负荷，Dry		250	°C
Temperature index	在20000h/5000h，后拉伸强度下降50%时		135/153	°C
specific heat	Dry		1.5	J/(g.K)
thermal conductivity	Dry		0.27	W/(m.K)
Electrical performance	Test Condition	Test Method	Test Result	Test Unit
Surface resistivity	干/湿		>10	Ω
Dielectric strength	K20/P50，干/湿		80/65	KV/mm
Compared to the Leakage Traceability Index (CTI)	干/湿		CTI 600 M
Compared to the Leakage Traceability Index (CTI)	Compared to the Leakage Traceability Index (CTI)	干/湿		CTI 500
Loss angle	1MHz，干/湿		0.02/0.1
Volume resistivity	干/湿		10	Ω.cm
Dielectric constant	1MHz，干/湿		3.7/5

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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