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产品描述
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物性表
产品描述
| 典型应用: | LCD | 应用 | 粘合剂 | 医疗 | 护理用品 | 电气 | 电子应用领域 | 光学应用 |
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物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 硬度 | ShoreD | 83 | ||
| LapShearStrength | 23°C | >13.8 | MPa | |
| 相对电容率 | 1kHz | 3.50 | ||
| 体积电阻率 | 23°C | >8.0E+12 | ohms·cm | |
| 耗散因数 | 1kHz | 4E-03 | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| Color | --8 | White | ||
| --7 | Amber | |||
| 密度 | 储存稳定性 | 240 | min | |
| 固化时间(150°C) | 1.0 | hr | ||
| 粘度9(23°C) | 14to20 | Pa·s | ||
| PartA | 1.33 | g/cm³ | ||
| PartB | 1.02 | g/cm³ | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 热固组件 | 贮藏期限(23°C) | 52 | wk | |
| 部件B | 按重量计算的混合比:1.0 | |||
| 部件A | 按重量计算的混合比:10 | |||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 线性热膨胀系数 | MD：--3 | 4.6E-05 | cm/cm/°C | |
| 玻璃转化温度 | >45.0 | °C | ||
| 导热系数 | --6 | 1.5 | W/m/K | |
| --5 | 0.70 | W/m/K | ||
| 线性热膨胀系数 | MD：--4 | 2.4E-04 | cm/cm/°C | |
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <20.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 操作温度 | ThixotropicIndex | 1.79 | ||
| StorageModulus(23°C) | 1.78 | GPa | ||
| Intermittent | -55-300 | °C | ||
| Continuous | -55-200 | °C | ||
| DieShearStrength | 23°C | 35.2 | MPa | |
| DegradationTemperature | TGA | 377 | °C | |
| 加热失重 | 300°C | 0.98 | % | |
| 250°C | 0.25 | % | ||
| 200°C | 0.020 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。