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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 粘合 | 电气 | 电子应用领域 | 粘合剂 |
认证
No Data...
物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 硬度 | ShoreD | 41 | ||
| LapShearStrength | 23°C | 9.89 | MPa | |
| 耗散因数 | 1kHz | 0.030 | ||
| 相对电容率 | 1kHz | 3.42 | ||
| 体积电阻率 | 23°C | >5.0E+12 | ohms·cm | |
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| Color | --5 | Clear/Transparent | ||
| --6 | Grey | |||
| 密度 | PartB | 1.01 | g/cm³ | |
| PartA | 1.36 | g/cm³ | ||
| 粘度7(23°C) | 40to70 | Pa·s | ||
| 固化时间(80°C) | 2.0 | hr | ||
| 储存稳定性 | 120 | min | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 热固组件 | 按重量计算的混合比 | 100 | ||
| 部件B | 按重量计算的混合比:15 | |||
| 贮藏期限(23°C) | 52 | wk | ||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 玻璃转化温度 | <40.0 | °C | ||
| 线性热膨胀系数 | MD：--3 | 5.9E-05 | cm/cm/°C | |
| MD：--4 | 2.2E-04 | cm/cm/°C | ||
| MD：导热系数 | 1.3 | W/m/K | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <20.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| DegradationTemperature | 338 | °C | ||
| DieShearStrength | 23°C | 11.7 | MPa | |
| 操作温度 | Continuous | -55-150 | °C | |
| Intermittent | -55-250 | °C | ||
| StorageModulus | 206 | MPa | ||
| ThixotropicIndex | 2.70 | |||
| 加热失重 | 200°C | 0.41 | % | |
| 250°C | 0.68 | % | ||
| 300°C | 1.4 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。