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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 印刷电路板 |
认证
No Data...
物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 相对电容率 | 1kHz | 6.32 | ||
| 体积电阻率 | 23°C | >1.2E+14 | ohms·cm | |
| 耗散因数 | 1kHz | 8E-03 | ||
| 硬度 | ShoreD | 68 | ||
| LapShearStrength | 23°C | 11.5 | MPa | |
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| Color | --5 | Amber | ||
| --6 | White | |||
| 密度 | PartB | 1.06 | g/cm³ | |
| PartA | 1.69 | g/cm³ | ||
| 粘度7(23°C) | 250to400 | Pa·s | ||
| 固化时间(150°C) | 1.0 | hr | ||
| 储存稳定性 | 180 | min | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 热固组件 | 部件A | 按重量计算的混合比:20 | ||
| 部件B | 按重量计算的混合比:1.0 | |||
| 贮藏期限(23°C) | 26 | wk | ||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 线性热膨胀系数 | MD：导热系数 | 0.40 | W/m/K | |
| 玻璃转化温度 | >100 | °C | ||
| 线性热膨胀系数 | MD：--3 | 2.2E-05 | cm/cm/°C | |
| MD：--4 | 7.9E-05 | cm/cm/°C | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <10.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 加热失重 | 300°C | 1.5 | % | |
| DegradationTemperature | 465 | °C | ||
| DieShearStrength | 23°C | 11.7 | MPa | |
| 操作温度 | Continuous | -55-250 | °C | |
| Intermittent | -55-350 | °C | ||
| StorageModulus(23°C) | 3.77 | GPa | ||
| 加热失重 | 200°C | 0.88 | % | |
| 250°C | 1.1 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。