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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 电气 | 电子应用领域 | 粘合剂 |
认证
No Data...
物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 硬度 | ShoreD | 91 | ||
| LapShearStrength | 23°C | 7.60 | MPa | |
| 相对电容率 | 1kHz | 4.75 | ||
| 体积电阻率 | 23°C | >3.0E+13 | ohms·cm | |
| 耗散因数 | 1kHz | 0.021 | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 密度 | 1.79 | g/cm³ | ||
| 粘度 | 23°C | 25to35 | Pa·s | |
| 固化时间 | 150°C | 1.0 | hr | |
| 储存稳定性 | 40000 | min | ||
| Color | Black | |||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 贮藏期限 | 52 | wk | ||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 线性热膨胀系数 | MD：导热系数 | 0.56 | W/m/K | |
| 玻璃转化温度 | >120 | °C | ||
| 线性热膨胀系数 | MD：--3 | 2.7E-05 | cm/cm/°C | |
| MD：--4 | 1.3E-04 | cm/cm/°C | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <50.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| DegradationTemperature | 418 | °C | ||
| DieShearStrength | 23°C | 23.4 | MPa | |
| 操作温度 | Continuous | -55-250 | °C | |
| Intermittent | -55-350 | °C | ||
| StorageModulus(23°C) | 3.21 | GPa | ||
| ThixotropicIndex | 1.13 | |||
| 加热失重 | 200°C | 0.050 | % | |
| 250°C | 0.19 | % | ||
| 300°C | 0.66 | % |
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