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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 粘合剂 | 电气 | 电子应用领域 | LCD | 应用 |
| 特性: | 填料 | 银 |
认证
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物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 硬度 | ShoreD | 60 | ||
| LapShearStrength | 23°C | 8.73 | MPa | |
| 体积电阻率 | 23°C | <5.0E-4 | ohms·cm | |
| 23°C8 | <9.0E-3 | ohms·cm | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 密度 | PartB | 0.948 | g/cm³ | |
| PartA | 3.09 | g/cm³ | ||
| 粘度7(23°C) | 0.80to1.6 | Pa·s | ||
| 固化时间(150°C) | 1.0 | hr | ||
| 储存稳定性 | 240 | min | ||
| Color | --5 | Clear/Transparent | ||
| --6 | Silver | |||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 热固组件 | 部件A | 按重量计算的混合比:10 | ||
| 部件B | 按重量计算的混合比:1.0 | |||
| 贮藏期限(23°C) | 52 | wk | ||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 线性热膨胀系数 | MD：--4 | 1.5E-04 | cm/cm/°C | |
| MD：导热系数 | 1.4 | W/m/K | ||
| 玻璃转化温度 | >40.0 | °C | ||
| 线性热膨胀系数 | MD：--3 | 4.8E-05 | cm/cm/°C | |
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <45.0 | µm | ||
| 离子类型 | Cl- | 151 | ppm | |
| K+ | 31 | ppm | ||
| Na+ | 23 | ppm | ||
| NH4+ | 23 | ppm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| DegradationTemperature | TGA | 380 | °C | |
| DieShearStrength | 23°C | 11.7 | MPa | |
| 操作温度 | 间歇 | <250 | °C | |
| StorageModulus | 23°C | 3.58 | GPa | |
| 触变指数 | 2.10 | |||
| 加热失重 | 200°C | 0.70 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。