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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 光学应用 | 电气 | 电子应用领域 |
认证
No Data...
物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 体积电阻率 | 23°C | >1.0E+13 | ohms·cm | |
| 耗散因数 | 1kHz | 4E-03 | ||
| 硬度 | ShoreD | 82 | ||
| LapShearStrength | 23°C | 11.3 | MPa | |
| 相对电容率 | 1kHz | 3.99 | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 密度 | 固化时间(150°C) | 1.0 | hr | |
| 储存稳定性 | 1400 | min | ||
| PartB | 1.03 | g/cm³ | ||
| PartA | 1.40 | g/cm³ | ||
| 粘度7(23°C) | 60to80 | Pa·s | ||
| Color | --5 | Amber | ||
| --6 | White | |||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 热固组件 | 按重量计算的混合比 | 100 | ||
| 贮藏期限(23°C) | 52 | wk | ||
| 部件B | 按重量计算的混合比:4.0 | |||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 玻璃转化温度 | >70.0 | °C | ||
| 线性热膨胀系数 | MD：--3 | 2.8E-05 | cm/cm/°C | |
| MD：--4 | 9.6E-05 | cm/cm/°C | ||
| MD：导热系数 | 1.1 | W/m/K | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <20.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| DegradationTemperature | 415 | °C | ||
| DieShearStrength | 23°C | 23.4 | MPa | |
| 操作温度 | Continuous | -55-200 | °C | |
| Intermittent | -55-300 | °C | ||
| StorageModulus(23°C) | 5.47 | GPa | ||
| ThixotropicIndex | 3.80 | |||
| 加热失重 | 200°C | 0.090 | % | |
| 250°C | 0.50 | % | ||
| 300°C | 1.3 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。