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物性表
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物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 体积电阻率 | 23°C | >2.0E+13 | ohms·cm | |
| 耗散因数 | 1kHz | 0.011 | ||
| 硬度 | ShoreD | 89 | ||
| LapShearStrength | 23°C | >13.8 | MPa | |
| 相对电容率 | 1kHz | 3.33 | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| Color | White | |||
| 密度 | 1.80 | g/cm³ | ||
| 粘度 | 23°C | 100to150 | Pa·s | |
| 固化时间 | 150°C | >1.0 | hr | |
| 储存稳定性 | 40000 | min | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 贮藏期限 | -40°C | 52 | wk | |
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 玻璃转化温度 | >90.0 | °C | ||
| 线性热膨胀系数 | MD：--2 | 4.7E-05 | cm/cm/°C | |
| MD：--3 | 1.7E-04 | cm/cm/°C | ||
| MD：导热系数 | 1.0 | W/m/K | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <20.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 加热失重 | 250°C | 0.44 | % | |
| 300°C | 0.90 | % | ||
| DegradationTemperature | 403 | °C | ||
| DieShearStrength | 23°C | 58.6 | MPa | |
| 操作温度 | Continuous | -55-200 | °C | |
| Intermittent | -55-300 | °C | ||
| StorageModulus | 3.42 | GPa | ||
| ThixotropicIndex | 4.10 | |||
| 加热失重 | 200°C | 0.060 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。