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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 垫圈 | 电气 | 电子应用领域 | 密封件 | LCD | 应用 |
认证
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物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 硬度 | ShoreD | 68 | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| Color | Yellow | |||
| 密度 | 1.14 | g/cm³ | ||
| 粘度 | 23°C | 20 | Pa·s | |
| 固化时间 | 70°C4 | 0.50 | hr | |
| 150°C | 1.0 | hr | ||
| 储存稳定性 | 22000 | min | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 贮藏期限 | 52 | wk | ||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 玻璃转化温度 | 50.0 | °C | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <20.0 | µm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 加热失重 | 300°C | 7.0 | % | |
| DegradationTemperature | 347 | °C | ||
| 操作温度 | Continuous | -55-175 | °C | |
| Intermittent | -55-275 | °C | ||
| StorageModulus | 2.48 | GPa | ||
| ThixotropicIndex | 2.60 | |||
| 加热失重 | 200°C | 0.80 | % | |
| 250°C | 3.6 | % |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。