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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 粘合 | 电气 | 电子应用领域 | 粘合剂 |
认证
No Data...
物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 耗散因数 | 1kHz | 0.010 | ||
| 体积电阻率 | 23°C | >2.0E+13 | ohms·cm | |
| 相对电容率 | 1kHz | 3.12 | ||
| LapShearStrength | 23°C | >13.8 | MPa | |
| 硬度 | ShoreD | 85 | ||
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 固化时间 | 125°C | >1.0 | hr | |
| 粘度 | 23°C | 10to22 | Pa·s | |
| 密度 | 1.20 | g/cm³ | ||
| Color | White | |||
| 储存稳定性 | 40000 | min | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 贮藏期限 | -40°C | 52 | wk | |
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 线性热膨胀系数 | MD：导热系数 | 0.77 | W/m/K | |
| MD：--3 | 2.1E-04 | cm/cm/°C | ||
| MD：--2 | 5.7E-05 | cm/cm/°C | ||
| 玻璃转化温度 | >40.0 | °C | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 加热失重 | 300°C | 0.44 | % | |
| 250°C | 0.14 | % | ||
| 操作温度 | ThixotropicIndex | 4.10 | ||
| StorageModulus(23°C) | 1.98 | GPa | ||
| Intermittent | -55-325 | °C | ||
| Continuous | -55-225 | °C | ||
| DieShearStrength | 23°C | 35.2 | MPa | |
| DegradationTemperature | TGA | 436 | °C |
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