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产品描述
认证(0)
物性表
产品描述
| 典型应用: | 电气 | 电子应用领域 | 粘合 | 航空航天应用 | 粘合剂 |
| 特性: | 填料 | 银 |
认证
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物性数据
| Cured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
|---|---|---|---|---|
| 硬度 | ShoreD | 60 | ||
| LapShearStrength | 23°C | 10.4 | MPa | |
| 体积电阻率 | 23°C | <9.0E-4 | ohms·cm | |
| Uncured Properties | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| Color | --5 | Silver | ||
| --6 | Silver | |||
| 密度 | PartB | 2.13 | g/cm³ | |
| PartA | 2.44 | g/cm³ | ||
| 粘度7(23°C) | 14to20 | Pa·s | ||
| 固化时间(150°C) | 1.0 | hr | ||
| 储存稳定性 | 900 | min | ||
| 热固性 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 热固组件 | 部件A | 按重量计算的混合比:10 | ||
| 部件B | 按重量计算的混合比:1.0 | |||
| 贮藏期限(23°C) | 52 | wk | ||
| 热性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 玻璃转化温度 | >100 | °C | ||
| 线性热膨胀系数 | MD：--4 | 2.3E-04 | cm/cm/°C | |
| MD：导热系数 | 1.0 | W/m/K | ||
| MD：--3 | 4.2E-05 | cm/cm/°C | ||
| 物理性能 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 颗粒大小 | <45.0 | µm | ||
| 离子类型 | Cl- | 64 | ppm | |
| Na+ | 72 | ppm | ||
| NH4+ | 121 | ppm | ||
| 补充信息 | 测试条件 | 测试方法 | 测试结果 | 测试单位 |
| 加热失重 | 250°C | 0.060 | % | |
| 300°C | 0.17 | % | ||
| 操作温度 | StorageModulus | 5.53 | GPa | |
| ThixotropicIndex | 2.60 | |||
| 加热失重 | 200°C | 0.030 | % | |
| DegradationTemperature | 416 | °C | ||
| DieShearStrength | 23°C | 23.4 | MPa | |
| 操作温度 | Continuous | -55-250 | °C | |
| Intermittent | -55-350 | °C |
免责声明：此数据表中的信息由 Plas.Com 从该材料的生产商或第三方处获得。Plas.Com 尽最大努力确保此数据的准确性。 但是 Plas.Com 对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。