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原料比对
产品信息
品名
品牌名
典型应用
特性
认证
Epoxy H67-MP 美国Epoxy
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粘合剂,电气,电子应用领域,军事应用
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物性数据
| 补充信息 | 测试条件 | 测试方法 | 美国Epoxy/H67-MP |
|---|---|---|---|
| DegradationTemperature | 350 °C | ||
| DieShearStrength | 23°C | 46.9 MPa | |
| StorageModulus | 23°C | 4.43 GPa | |
| 操作温度 | 间歇 | <300 °C | |
| 加热失重 | 250°C | 0.71 % | |
| 200°C | 0.48 % | ||
| 300°C | 1.2 % |
| 热性能 | 测试条件 | 测试方法 | 美国Epoxy/H67-MP |
|---|---|---|---|
| 玻璃转化温度 | >90.0 °C | ||
| 线性热膨胀系数 | MD：导热系数 | 0.50 W/m/K | |
| MD：--4 | 6.8E-05 cm/cm/°C | ||
| MD：--3 | 1.6E-05 cm/cm/°C |
| 热固性 | 测试条件 | 测试方法 | 美国Epoxy/H67-MP |
|---|---|---|---|
| 贮藏期限 | -40°C | 52 wk |
| Uncured Properties | 测试条件 | 测试方法 | 美国Epoxy/H67-MP |
|---|---|---|---|
| Color | White | ||
| 储存稳定性 | 40000 min | ||
| 固化时间 | 150°C | 1.0 hr | |
| 密度 | 2.00 g/cm³ | ||
| 粘度 | 23°C | 300to400 Pa·s |
| Cured Properties | 测试条件 | 测试方法 | 美国Epoxy/H67-MP |
|---|---|---|---|
| LapShearStrength | 23°C | 10.5 MPa | |
| 耗散因数 | 1kHz | 4E-03 | |
| 体积电阻率 | 23°C | >6.0E+13 ohms·cm | |
| 相对电容率 | 1kHz | 4.92 | |
| 硬度 | ShoreD | 84 |
| 物理性能 | 测试条件 | 测试方法 | 美国Epoxy/H67-MP |
|---|---|---|---|
| 颗粒大小 | <20.0 µm | ||
| 离子类型 | K+ | <50 ppm | |
| Cl- | <200 ppm | ||
| Na+ | <50 ppm | ||
| NH4+ | 87 ppm |