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原料比对
产品信息
品名
品牌名
典型应用
特性
认证
POM KFX-1006 BK8-114 基础创新塑料(美国)
LNP™ THERMOCOMP™
电子电器部件,连接器
耐高温,耐低温
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物性数据
| 热性能 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1006 BK8-114 |
|---|---|---|---|
| 热变形温度 | 1.8MPa,未退火,3.20mm | ASTM D648 | 162 °C |
| 机械性能 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1006 BK8-114 |
|---|---|---|---|
| 拉伸强度 | 断裂 | ASTM D638 | 148 Mpa |
| 伸长率 | 断裂 | ASTM D638 | 2.8 % |
| 弯曲模量 | ASTM D790 | 10300 Mpa | |
| 弯曲强度 | ASTM D790 | 214 Mpa |
| 物理性能 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1006 BK8-114 |
|---|---|---|---|
| 收缩率 | MD：24小时 | ASTM D955 | 0.50 % |
| TD：24hr | ASTM D955 | 2.0 % |