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原料比对
产品信息
品名
品牌名
典型应用
特性
认证
POM KFX-1004 BK 基础创新塑料(美国)
LNP™ THERMOCOMP™
电子电器部件,连接器
耐高温,耐低温
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物性数据
| 热性能 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1004 BK |
|---|---|---|---|
| 热变形温度 | 1.8 MPa, 未退火, 3.20 mm | ASTM D648 | 162 °C |
| 冲击性能 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1004 BK |
|---|---|---|---|
| 悬壁梁无缺口冲击强度 | 23°C | ASTM D4812 | 590 J/m |
| 机械性能 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1004 BK |
|---|---|---|---|
| 拉伸强度 | 断裂 | ASTM D638 | 108 Mpa |
| 伸长率 | 断裂 | ASTM D638 | 2.3 % |
| 弯曲模量 | ASTM D790 | 8200 Mpa | |
| 弯曲强度 | ASTM D790 | 186 Mpa |
| 注射 | 测试条件 | 测试方法 | 基础创新塑料(美国)/KFX-1004 BK |
|---|---|---|---|
| 背压 | 0.200 to 0.300 Mpa | ||
| 干燥时间 | 4.0 hr | ||
| 干燥温度 | 80 °C | ||
| 加工（熔体）温度 | 200 to 215 °C | ||
| 料筒后部温度 | 175 to 190 °C | ||
| 料筒前部温度 | 210 to 220 °C | ||
| 料筒中部温度 | 195 to 205 °C | ||
| 螺杆转速 | 30 to 60 rpm | ||
| 模具温度 | 80 to 110 °C |