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原料比对
产品信息
品名
品牌名
典型应用
特性
认证
PFA AP-211SH 日本大金
NEOFLON®
半导体模制化合物,半导体模制化合物
耐候,阻燃
UL
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物性数据
| 热性能 | 测试条件 | 测试方法 | 日本大金/AP-211SH |
|---|---|---|---|
| UL阻燃等级 | 1.57 mm | UL 94 | V-0 |
| 比热 | No Standard | 1050 J/kg/℃ | |
| 导热系数 | ASTM C177 | 0.26 W/m/K | |
| 极限氧指数 | 1.57 mm | ASTM D2863 | > 95 % |
| 熔融温度 | ASTM D-1523 | 300 to 310 °C | |
| 线性热膨胀系数 | 20 到 100℃ | ASTM D696 | 0.00012 cm/cm/℃ |
| 充模分析 | 测试条件 | 测试方法 | 日本大金/AP-211SH |
|---|---|---|---|
| 熔体粘度 | 380℃ | No Standard | 2.00E+6 - 2.50E+7 mPa·s |
| 物理性能 | 测试条件 | 测试方法 | 日本大金/AP-211SH |
|---|---|---|---|
| 表观密度 | JIS K6891 | 1.00 to 1.40 g/cm³ | |
| 熔体质量流动速率 | 372℃/5.0 kg | ASTM D1238 | 10 to 18 g/10 min |
| 吸水率 | 饱和 | ASTM D570 | < 0.010 % |