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Epoxy EPO-TEK® H62 Epoxy Technology Inc.

Typical Applications:
Adhesive electrical and electronic application fields
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesive | electrical | and electronic application fields

Certificates

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Relative permittivity1kHz4.65
Volume resistivity23°C>2.0E+13ohms·cm
Dissipation factor1kHz0.011
Shore hardnessShoreD80
LapShearStrength23°C4.14MPa
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
viscosity23°C17to27Pa·s
Curing time150°C1.0hr
storage stability22000min
ColorBlackOpaque
density1.78g/cm³
optical performanceTest ConditionTest MethodTest ResultTest Unit
transmissivity300to2500nm<1.0%
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>110°C
Linear coefficient of thermal expansionMD:--34.8E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.2E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数0.50W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeNH4+96ppm
Particle size distribution<50.0µm
Ionic typeCl-55ppm
Ionic typeK+28ppm
Ionic typeNa+136ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating200°C0.31%
weight loss on heating250°C0.42%
weight loss on heating300°C0.62%
operate temperatureContinuous-55-275°C
operate temperatureIntermittent-55-375°C
operate temperatureStorageModulus(23°C)4.53GPa
operate temperatureThixotropicIndex1.89
DegradationTemperatureTGA436°C
Shear Strength23°C35.2MPa
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.