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Epoxy EPO-TEK® H61-110 Epoxy Technology Inc.

Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Relative permittivity1kHz3.63
LapShearStrength23°C5.23MPa
Shore hardnessShoreD83
Dissipation factor1kHz7E-03
Volume resistivity23°C>1.0E+13ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
storage stability40000min
Curing time150°C1.0hr
viscosity23°C2.0to4.0Pa·s
density1.22g/cm³
ColorTransparent.LightYellow
optical performanceTest ConditionTest MethodTest ResultTest Unit
Refractive index1.546
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--41.5E-04cm/cm/°C
Linear coefficient of thermal expansionMD:--34.9E-05cm/cm/°C
Glass transition temperature>110°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeCl-12ppm
Ionic typeNa+275ppm
Ionic typeK+15ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus2.00GPa
operate temperatureContinuous-55-200°C
Shear Strength23°C35.2MPa
DegradationTemperature420°C
weight loss on heating300°C0.84%
weight loss on heating250°C0.64%
weight loss on heating200°C0.38%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.