Epoxy T7109-19

0
  • Usages:
    Adhesives
    electrical
    electronic applications
    adhesives

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
ColorClear/Transparent
ColorGrey
density1.01 g/cm³
density1.36 g/cm³
density40to70 Pa·s
density2.0 hr
densityPot Life120 min
Cured PropertiesTest ConditionTest MethodTest Result
Shore hardness41
LapShearStrength9.89 MPa
Dissipation Factor0.030
relative permittivity3.42
Volume resistivity>5.0E+12 ohms·cm
physical property Test ConditionTest MethodTest Result
Particle size<20.0 µm
thermosettingTest ConditionTest MethodTest Result
Thermosetting components100
Thermosetting components按重量计算的混合比:15
Thermosetting components52 wk
Supplementary InformationTest ConditionTest MethodTest Result
DegradationTemperature338 °C
Shear Strength11.7 MPa
operate temperature-55-150 °C
operate temperature-55-250 °C
operate temperature206 MPa
operate temperature2.70
weight loss on heating0.41 %
weight loss on heating0.68 %
weight loss on heating1.4 %
Thermal performanceTest ConditionTest MethodTest Result
Glass Transition Temperature<40.0 °C
Linear coefficient of thermal expansion5.9E-05 cm/cm/°C
Linear coefficient of thermal expansion2.2E-04 cm/cm/°C
Linear coefficient of thermal expansion1.3 W/m/K
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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