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Epoxy EPO-TEK® E3037 Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD80
LapShearStrength23°C13.0MPa
Volume resistivity23°C<5.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
viscosity23°C22to26Pa·s
Curing time150°C1.0hr
storage stability40000min
ColorSilver
density3.06g/cm³
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>90.0°C
Linear coefficient of thermal expansionMD:--25.2E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--31.5E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数1.6W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeCl-187ppm
Ionic typeK+3ppm
Ionic typeNa+22ppm
Ionic typeNH4+65ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating250°C0.41%
weight loss on heating300°C0.80%
DegradationTemperature358°C
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)5.02GPa
operate temperatureThixotropicIndex3.62
weight loss on heating200°C0.13%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.