Epoxy H67-MP

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  • Usages:
    Adhesives
    electrical
    electronic applications
    military applications

Technical Data Sheet

physical property Test ConditionTest MethodTest Result
Particle size<20.0 µm
Ionic type<200 ppm
Ionic type<50 ppm
Ionic type<50 ppm
Ionic type87 ppm
Uncured PropertiesTest ConditionTest MethodTest Result
colourWhite
density2.00 g/cm³
300到400 Pa·s
Curing Time1.0 hr
STORAGE STABILITY40000 min
Cured PropertiesTest ConditionTest MethodTest Result
Dissipation Factor4E-03
Supporting hardness84
LapShearStrength10.5 MPa
4.92
Volume resistivity>6.0E+13 ohms·cm
thermosettingTest ConditionTest MethodTest Result
shelf-life52 wk
Supplementary InformationTest ConditionTest MethodTest Result
WeightLossonHeating1.2 %
WeightLossonHeating0.48 %
WeightLossonHeating0.71 %
DegradationTemperature350 °C
Shear Strength46.9 MPa
Operating<300 °C
StorageModulus4.43 GPa
Thermal performanceTest ConditionTest MethodTest Result
Glass Transition Temperature>90.0 °C
1.6E-05 cm/cm/°C
6.8E-05 cm/cm/°C
Linear coefficient of thermal expansion0.50 W/m/K
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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