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Epoxy H67-MP Epoxy Technology Inc.

Typical Applications:
Adhesives electrical electronic applications military applications
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesives | electrical | electronic applications | military applications

Certificates

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Dissipation factor1kHz4E-03
Shore hardnessShoreD84
LapShearStrength23°C10.5MPa
Relative permittivity1kHz4.92
Volume resistivity23°C>6.0E+13ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorWhite
density2.00g/cm³
viscosity23°C300to400Pa·s
Curing time150°C1.0hr
storage stability40000min
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>90.0°C
Linear coefficient of thermal expansionMD:--31.6E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--46.8E-05cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数0.50W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Ionic typeCl-<200ppm
Ionic typeK+<50ppm
Ionic typeNa+<50ppm
Ionic typeNH4+87ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C1.2%
weight loss on heating200°C0.48%
weight loss on heating250°C0.71%
DegradationTemperature350°C
Shear Strength23°C46.9MPa
operate temperature间歇<300°C
StorageModulus23°C4.43GPa
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.