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Epoxy OG116 Epoxy Technology Inc.
Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Electrical and electronic applications | adhesives |
Certificates
No Data...
Technical Data Sheet
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Color | Clear/Transparent | |||
| density | 1.20 | g/cm³ | ||
| viscosity | 23°C | 89 | Pa·s | |
| optical performance | Test Condition | Test Method | Test Result | Test Unit |
| Refractive index | --4 | 1.573 | ||
| --5 | 1.589 | |||
| transmissivity | 400nm | 89.0 | % | |
| 560to1660nm | >98.0 | % | ||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| shelf-life | 23°C | 52 | wk | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Glass transition temperature | 146 | °C | ||
| Linear coefficient of thermal expansion | MD：--2 | 5.6E-05 | cm/cm/°C | |
| MD：--3 | 1.7E-04 | cm/cm/°C | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| operate temperature | StorageModulus | 1.49 | GPa | |
| DegradationTemperature | 424 | °C | ||
| operate temperature | Continuous | -55-200 | °C | |
| Intermittent | -55-300 | °C | ||
| weight loss on heating | 200°C | 0.19 | % | |
| 250°C | 0.40 | % | ||
| 300°C | 0.68 | % |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.