PP S1003 SECCO SHANGHAI

Form：Granules | Grade：Wire drawing grade

Properties:

high strengthHigh rigidityHigh temperature resistan

Typical Applications:

chipcontainer

Supplier(1)

Product Description

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Datasheet

Product Description

Typical Applications:	chip \| container
Properties:	high strength \| High rigidity \| High temperature resistan

Certificates

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Technical Data Sheet

other	Test Condition	Test Method	Test Result	Test Unit
Color			黄色指数 2
characteristic			单丝.带.绳。
Other performance	Test Condition	Test Method	Test Result	Test Unit
Huangdu Index		ASTM D-192563T	2	%
Basic Performance	Test Condition	Test Method	Test Result	Test Unit
melt mass-flow rate		ASTM D-1238	3.0	g/10min
density		ASTM D-1505	0.905
mechanical properties	Test Condition	Test Method	Test Result	Test Unit
Bending modulus		ASTM D790/ISO 178	1470	kg/cm²(MPa)[Lb/in²]
Rockwell hardness		ASTM D785	94
tensile strength		ASTM D638/ISO 527	35.3	kg/cm²(MPa)[Lb/in²]
Elongation at Break		ASTM D638/ISO 527	>200	%
Impact strength of cantilever beam gap		ASTM D256/ISO 179	29	kg·cm/cm(J/M)ft·lb/in
elongation	Break	ASTM D-638	>200	%
Impact strength of cantilever beam gap	23℃	ASTM D-256	29	J/m
tensile strength	Yield	ASTM D-638	35.3	Mpa
Rockwell hardness		ASTM D-785	94	R-Scale
Bending modulus		ASTM D-790A	1470	Mpa
thermal performance	Test Condition	Test Method	Test Result	Test Unit
Hot deformation temperature	HDT	ASTM D648/ISO 75	100	℃（℉）
Hot deformation temperature	Hot deformation temperature	0.46MPa	ASTM D-648	100	°C
Physical properties	Test Condition	Test Method	Test Result	Test Unit
melt mass-flow rate		ASTM D1238/ISO 1133	3.0	g/10min
density		ASTM D792/ISO 1183	0.905

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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