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PP S1003 SECCO SHANGHAI

240

Form:Granules | Grade:Wire drawing grade

Properties:
high strengthHigh rigidityHigh temperature resistan
Typical Applications:
chipcontainer
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:chip | container
Properties:high strength | High rigidity | High temperature resistan

Certificates

No Data...

Technical Data Sheet

otherTest ConditionTest MethodTest ResultTest Unit
characteristic单丝.带.绳。
Color黄色指数 2
Other performanceTest ConditionTest MethodTest ResultTest Unit
Huangdu IndexASTM D-192563T2%
Basic PerformanceTest ConditionTest MethodTest ResultTest Unit
densityASTM D-15050.905
melt mass-flow rateASTM D-12383.0g/10min
mechanical propertiesTest ConditionTest MethodTest ResultTest Unit
Bending modulusASTM D-790A1470Mpa
Rockwell hardnessASTM D-78594R-Scale
tensile strengthYieldASTM D-63835.3Mpa
Impact strength of cantilever beam gap23℃ASTM D-25629J/m
elongationBreakASTM D-638>200%
Impact strength of cantilever beam gapASTM D256/ISO 17929kg·cm/cm(J/M)ft·lb/in
Elongation at BreakASTM D638/ISO 527>200%
tensile strengthASTM D638/ISO 52735.3kg/cm²(MPa)[Lb/in²]
Rockwell hardnessASTM D78594
Bending modulusASTM D790/ISO 1781470kg/cm²(MPa)[Lb/in²]
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Hot deformation temperature0.46MPaASTM D-648100°C
Hot deformation temperatureHDTASTM D648/ISO 75100℃(℉)
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
densityASTM D792/ISO 11830.905
melt mass-flow rateASTM D1238/ISO 11333.0g/10min
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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