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Epoxy EPO-TEK® H55 Epoxy Technology Inc.
Typical Applications:
printed circuit board
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | printed circuit board |
Certificates
No Data...
Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Dissipation factor | 1kHz | 8E-03 | ||
| Volume resistivity | 23°C | >1.2E+14 | ohms·cm | |
| Relative permittivity | 1kHz | 6.32 | ||
| Shore hardness | ShoreD | 68 | ||
| LapShearStrength | 23°C | 11.5 | MPa | |
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| density | 固化时间(150°C) | 1.0 | hr | |
| 粘度7(23°C) | 250to400 | Pa·s | ||
| PartA | 1.69 | g/cm³ | ||
| PartB | 1.06 | g/cm³ | ||
| Pot Life | 180 | min | ||
| Color | --6 | White | ||
| --5 | Amber | |||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| Thermosetting components | Shelf Life(23°C) | 26 | wk | |
| PartB | 按重量计算的混合比:1.0 | |||
| PartA | 按重量计算的混合比:20 | |||
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | MD：--4 | 7.9E-05 | cm/cm/°C | |
| MD：--3 | 2.2E-05 | cm/cm/°C | ||
| Glass transition temperature | >100 | °C | ||
| Linear coefficient of thermal expansion | MD：导热系数 | 0.40 | W/m/K | |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Particle size distribution | <10.0 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| operate temperature | Continuous | -55-250 | °C | |
| Shear Strength | 23°C | 11.7 | MPa | |
| DegradationTemperature | 465 | °C | ||
| weight loss on heating | 300°C | 1.5 | % | |
| 250°C | 1.1 | % | ||
| 200°C | 0.88 | % | ||
| operate temperature | StorageModulus(23°C) | 3.77 | GPa | |
| Intermittent | -55-350 | °C |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.