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Epoxy H70E-175 Epoxy Technology Inc.
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Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Relative permittivity | 1kHz | 4.72 | ||
| Volume resistivity | 23°C | 2E+13 | ohms·cm | |
| LapShearStrength | 23°C | >13.8 | MPa | |
| Shore hardness | ShoreD | 88 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| Color | --5 | Grey | ||
| --6 | Grey | |||
| density | PartA | 1.36 | g/cm³ | |
| PartB | 1.92 | g/cm³ | ||
| 粘度7(23°C) | 5.0to11 | Pa·s | ||
| 固化时间(180°C) | 1.0 | hr | ||
| Pot Life | 2900 | min | ||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| Thermosetting components | PartA | 按重量计算的混合比:1.0 | ||
| PartB | 按重量计算的混合比:1.0 | |||
| Shelf Life(23°C) | 52 | wk | ||
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | MD：导热系数 | 0.32 | W/m/K | |
| Glass transition temperature | >70.0 | °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 2.6E-05 | cm/cm/°C | |
| MD：--4 | 8.4E-05 | cm/cm/°C | ||
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Particle size distribution | <20.0 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| operate temperature | Intermittent | -55-300 | °C | |
| DegradationTemperature | TGA | 392 | °C | |
| Shear Strength | 23°C | 9.38 | MPa | |
| operate temperature | Continuous | -55-200 | °C | |
| StorageModulus(23°C) | 5.22 | GPa | ||
| ThixotropicIndex | 2.55 | |||
| weight loss on heating | 200°C | 0.59 | % | |
| 250°C | 1.4 | % | ||
| 300°C | 3.3 | % |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.