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Epoxy EPO-TEK® H63 Epoxy Technology Inc.

Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD91
LapShearStrength23°C7.60MPa
Relative permittivity1kHz4.75
Volume resistivity23°C>3.0E+13ohms·cm
Dissipation factor1kHz0.021
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
density1.79g/cm³
viscosity23°C25to35Pa·s
Curing time150°C1.0hr
storage stability40000min
ColorBlack
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数0.56W/m/K
Glass transition temperature>120°C
Linear coefficient of thermal expansionMD:--32.7E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.3E-04cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<50.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperature418°C
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-250°C
operate temperatureIntermittent-55-350°C
operate temperatureStorageModulus(23°C)3.21GPa
operate temperatureThixotropicIndex1.13
weight loss on heating200°C0.050%
weight loss on heating250°C0.19%
weight loss on heating300°C0.66%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.