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Epoxy EPO-TEK® EE149-6 Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD74
LapShearStrength23°C3.78MPa
Volume resistivity23°C<5.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
density3.26g/cm³
viscosity23°C2.0to4.0Pa·s
Curing timePot Life36000min
Curing time180°C1.0hr
ColorSilver
Curing time70°C60.17hr
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数0.98W/m/K
Linear coefficient of thermal expansionMD:--41.1E-04cm/cm/°C
Linear coefficient of thermal expansionMD:--33.4E-05cm/cm/°C
Glass transition temperature>130°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeCl-4ppm
Particle size distribution<20.0µm
Ionic typeNH4+10ppm
Ionic typeNa+8ppm
Ionic typeK+5ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C0.16%
weight loss on heating250°C0.050%
operate temperatureThixotropicIndex4.70
operate temperatureStorageModulus(23°C)3.77GPa
operate temperatureIntermittent-55-300°C
operate temperatureContinuous-55-200°C
Shear Strength23°C35.2MPa
DegradationTemperature380°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.