Epoxy Devcon DFense Blok

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Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
Curing Time16 hr
physical property Test ConditionTest MethodTest Result
density2.21 g/cm³
Specific volume0.455 cm³/g
Shrinkage rateASTMD25660.050 %
Solid content by volume100 %
thermosettingTest ConditionTest MethodTest Result
按容量计算的混合比:2.0按重量计算的混合比:100
按容量计算的混合比:1.0按重量计算的混合比:45
25 min
hardnessTest ConditionTest MethodTest Result
ASTMD224077
Supplementary InformationTest ConditionTest MethodTest Result
TensileShearAdhesionASTMD100218.0 MPa
TemperatureResistance149 °C
TemperatureResistance60 °C
Mechanical propertiesTest ConditionTest MethodTest Result
bending strengthASTMD79054.3 MPa
compressive strengthASTMD69549.3 MPa
Electrical performanceTest ConditionTest MethodTest Result
dielectric constantASTMD15049.0
Thermal performanceTest ConditionTest MethodTest Result
ASTMD6965.2E-05 cm/cm/°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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