PPO CN5258-BK1066 SABIC INNOVATIVE THAILAND

Form：Granules | Grade：Injection grade

Properties:

High rigidityHigh toughnessFiller: Filler40%Filler by weight

Typical Applications:

chip

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Datasheet

Product Description

Typical Applications:	chip
Properties:	High rigidity \| High toughness \| Filler: Filler \| 40% \| Filler by weight

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Technical Data Sheet

mechanical properties	Test Condition	Test Method	Test Result	Test Unit
bending strength		ASTM D790	159	Mpa
Bending modulus		ASTM D790	10000	Mpa
elongation	Break	Internal Method	5.0	%
tensile strength	Yield	Internal Method	120	Mpa
thermal performance	Test Condition	Test Method	Test Result	Test Unit
Linear coefficient of thermal expansion	MD：-30to30°C	ASTME831	2.1E-5到3.3E-5	cm/cm/°C
Hot deformation temperature	1.8MPa,Unannealed,6.40mm	ASTM D648	125	°C
Physical properties	Test Condition	Test Method	Test Result	Test Unit
Water absorption rate	24hr	ASTM D570	0.060	%
Shrinkage rate	MD：3.20mm	Internal Method	0.15-0.25	%

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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