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PC/ABS T65PG COVESTRO SHANGHAI
161
Form：Granules | Grade：Electroplating grade
Properties:
High mobility
Typical Applications:
Electrical fieldElectronic field
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Electrical field | Electronic field |
| Properties: | High mobility |
Certificates
No Data...
Technical Data Sheet
| other | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| purpose | 汽车部件.电器等 | |||
| characteristic | 电镀级 | |||
| mechanical properties | Test Condition | Test Method | Test Result | Test Unit |
| Impact strength of cantilever beam gap | ASTM D256/ISO 179 | 45 | kg·cm/cm(J/M)ft·lb/in | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Hot deformation temperature | HDT | ASTM D648/ISO 75 | 122 | ℃（℉） |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| melt mass-flow rate | ASTM D1238/ISO 1133 | 18 | g/10min |
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