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Epoxy EPO-TEK® H20F Epoxy Technology Inc.

Typical Applications:
Adhesives electrical electronic applications bonding
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesives | electrical | electronic applications | bonding

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreA46
Volume resistivity23°C<1.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
densityPartB3.55g/cm³
density粘度6(23°C)1.5to3.0Pa·s
density固化时间(150°C)1.0hr
densityPot Life2200min
Color--5Silver
densityPartA2.50g/cm³
Color--4Silver
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsShelf Life(23°C)52wk
Thermosetting componentsPartA按重量计算的混合比:1.0
Thermosetting componentsPartB按重量计算的混合比:1.0
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>20.0°C
Linear coefficient of thermal expansionMD31E-05cm/cm/°C
thermal conductivity4.1W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<45.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperatureTGA384°C
operate temperatureContinuous-55-175°C
operate temperatureIntermittent-55-275°C
operate temperatureStorageModulus(23°C)146MPa
operate temperatureThixotropicIndex4.00
Shear Strength23°C4.69MPa
weight loss on heating200°C0.51%
weight loss on heating250°C0.78%
weight loss on heating300°C1.8%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.