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Epoxy 320-LV Epoxy Technology Inc.

Typical Applications:
Adhesives printed circuit boards electrical and electronic applications
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesives | printed circuit boards | electrical and electronic applications

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD84
LapShearStrength23°C11.6MPa
Relative permittivity1kHz11.4
Volume resistivity23°C>2.0E+9ohms·cm
Dissipation factor1kHz0.28
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Color--5Black
Color--6Clear/Transparent
densityPartB0.868g/cm³
densityPartA1.20g/cm³
density粘度7(23°C)0.35to0.65Pa·s
density固化时间(65°C)2.0hr
densityPot Life60min
optical performanceTest ConditionTest MethodTest ResultTest Unit
transmissivity300to2500nm<1.0%
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsPartA按重量计算的混合比:10
Thermosetting componentsPartB按重量计算的混合比:2.0
Thermosetting componentsShelf Life(23°C)52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--41.7E-04cm/cm/°C
Glass transition temperature>55.0°C
Linear coefficient of thermal expansionMD:--34.8E-05cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
operate temperatureStorageModulus(23°C)1.84GPa
weight loss on heating200°C0.26%
weight loss on heating250°C0.52%
weight loss on heating300°C1.0%
DegradationTemperature397°C
Shear Strength23°C35.2MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.