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Epoxy EPO-TEK® H27D Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Printed circuit boards electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Printed circuit boards | electrical and electronic applications | adhesives
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD55
LapShearStrength23°C8.88MPa
Volume resistivity23°C<5.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Color--5Amber
Color--6Silver
densityPartB1.22g/cm³
densityPartA3.78g/cm³
density粘度7(23°C)2.5to4.0Pa·s
density固化时间(150°C)1.0hr
densityPot Life480min
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsPartA按重量计算的混合比:10
Thermosetting componentsPartB按重量计算的混合比:1.0
Thermosetting componentsShelf Life(23°C)52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--41.2E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数1.2W/m/K
Glass transition temperature>80.0°C
Linear coefficient of thermal expansionMD:--32.9E-05cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<45.0µm
Ionic typeCl-8ppm
Ionic typeK+10ppm
Ionic typeNa+25ppm
Ionic typeNH4+7ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperatureTGA413°C
Shear Strength23°C35.2MPa
operate temperatureContinuous-55-225°C
operate temperatureIntermittent-55-325°C
operate temperatureStorageModulus(23°C)3.72GPa
operate temperatureThixotropicIndex1.30
weight loss on heating200°C0.49%
weight loss on heating250°C0.50%
weight loss on heating300°C0.63%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.