PBT SK652FR1 BK507 DUPONT USA

Form：Granules | Grade：Extrusion grade

Properties:

Easy to processFlame retardantenhanceGlass fiber reinforced 30% glass fiber reinforcMechanical properties are

Typical Applications:

Laptop caseElectronic fieldElectrical field

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Product Description

Certificates(1)

Datasheet

Product Description

Typical Applications:	Laptop case \| Electronic field \| Electrical field
Properties:	Easy to process \| Flame retardant \| enhance \| Glass fiber reinforced \| 30% glass fiber reinforc \| Mechanical properties are

Certificates

Technical Data Sheet

machinability	Test Condition	Test Method	Test Result	Test Unit
Forming temperature			86-266	°C
Melting temperature			464-500	°C
mechanical properties	Test Condition	Test Method	Test Result	Test Unit
Bending modulus		ASTM D-638	1740	Ksi
Bending modulus	Bending modulus		ASTM D-790	1400	Ksi
Elongation at Break		ASTM D-638	2.4	%
tensile strength		ASTM D-638	20500	psi
Impact strength of cantilever beam gap		ASTM D-256	1.17	ft-lb/in
Suspended wall beam without notch impact strength		ASTM D-4812	9.6	ft-lb/in
tensile strength		ASTM D-790	31500	psi
thermal performance	Test Condition	Test Method	Test Result	Test Unit
Hot deformation temperature	HDT	ASTM D-648	439（419）	°C
Melting temperature		ASTM D-3418	437	°C
Physical properties	Test Condition	Test Method	Test Result	Test Unit
Shrinkage rate		ASTM D-955	0.003	in/in
Shrinkage rate	Shrinkage rate	Across Flow	ASTM D-792	0.008	in/in
Electrical performance	Test Condition	Test Method	Test Result	Test Unit
Dielectric strength	3.2mm	ASTM D-149	584	KV/in
Electrical constants	1MHz（1KHz）	ASTM D-150	4（4.2）
Dielectric loss	1MHz（1KHz）	ASTM D-150	0.014（0.002）

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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