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Epoxy EPO-TEK® H20E-HC Epoxy Technology Inc.

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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Volume resistivity23°C<8.0E-5ohms·cm
Shore hardnessShoreD93
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
density固化时间(150°C)1.0hr
density粘度8(23°C)3.5to6.0Pa·s
densityPartB4.38g/cm³
densityPartA3.43g/cm³
Color--7Silver
Color--6Silver
densityPot Life3600min
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsShelf Life(23°C)52wk
Thermosetting componentsPartB按重量计算的混合比:1.0
Thermosetting componentsPartA按重量计算的混合比:1.0
thermal performanceTest ConditionTest MethodTest ResultTest Unit
thermal conductivity--523W/m/K
thermal conductivity--411W/m/K
Linear coefficient of thermal expansionMD:--38E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--25.3E-05cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeNH4+45ppm
Ionic typeNa+24ppm
Ionic typeK+17ppm
Ionic typeCl-34ppm
Particle size distribution<45.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
Shear Strength23°C11.7MPa
DegradationTemperature372°C
weight loss on heating300°C1.1%
weight loss on heating250°C0.42%
operate temperatureContinuous-55-175°C
operate temperatureIntermittent-55-275°C
operate temperatureStorageModulus3.95GPa
operate temperatureThixotropicIndex3.48
weight loss on heating200°C0.14%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.