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PI, TS P10 Epoxy Technology Inc.

Properties:
Filler silver
Product Description
Certificates(0)
Datasheet

Product Description

Properties:Filler | silver

Certificates

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD73
Volume resistivity23°C<5.0E-3ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorSilver
density2.48g/cm³
viscosity23°C9.0to15Pa·s
Curing time80°C6<0.50hr
Curing time150°C1.0hr
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life23°C52wk
Post curing time285°C1.5hr
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--33.3E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.2E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数7.9W/m/K
Glass transition temperature>100°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeNa+75ppm
Ionic typeNH4+28ppm
Particle size distribution<20.0µm
Ionic typeCl-224ppm
Ionic typeK+37ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)2.81GPa
operate temperatureThixotropicIndex3.60
weight loss on heating200°C<0.050%
weight loss on heating250°C<0.050%
weight loss on heating300°C0.090%
DegradationTemperature331°C
Shear Strength23°C11.7MPa
operate temperatureContinuous-55-200°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.