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PI, TS P1011S Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Adhesive electrical and electronic application fields
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesive | electrical | and electronic application fields
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Volume resistivity23°C<5.0E-4ohms·cm
Shore hardnessShoreD71
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Curing time150°C1.0hr
Curing time80°C6<0.50hr
viscosity23°C6.5to11Pa·s
density2.43g/cm³
ColorSilver
thermosettingTest ConditionTest MethodTest ResultTest Unit
drying time7.0day
Post curing time285°C1.5hr
shelf-life23°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--32.8E-05cm/cm/°C
Glass transition temperature>100°C
Linear coefficient of thermal expansionMD:导热系数>2.8W/m/K
Linear coefficient of thermal expansionMD:--45.7E-05cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C0.16%
weight loss on heating250°C0.090%
weight loss on heating200°C0.080%
operate temperatureThixotropicIndex1.80
operate temperatureStorageModulus(23°C)4.41GPa
operate temperatureIntermittent-55-325°C
operate temperatureContinuous-55-225°C
Shear Strength23°C9.38MPa
DegradationTemperatureTGA379°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.