PI, TS P1011S Epoxy Technology Inc.

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  • Properties:
    Filler
    silver
  • Usages:
    Adhesive
    electrical
    and electronic application fields

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
颜色Silver
密度2.43 g/cm³
粘度23°C6.5到11 Pa·s
固化时间80°C6<0.50 hr
固化时间150°C1.0 hr
Cured PropertiesTest ConditionTest MethodTest Result
支撐硬度ShoreD71
体积电阻率23°C<5.0E-4 ohms·cm
物理性能Test ConditionTest MethodTest Result
颗粒大小<20.0 µm
补充信息Test ConditionTest MethodTest Result
WeightLossonHeating200°C0.080 %
WeightLossonHeating250°C0.090 %
WeightLossonHeating300°C0.16 %
DegradationTemperatureTGA379 °C
DieShearStrength->23°C9.38 MPa
OperatingTemperatureContinuous-55到225 °C
OperatingTemperatureIntermittent-55到325 °C
OperatingTemperatureStorageModulus(23°C)4.41 GPa
OperatingTemperatureThixotropicIndex1.80
热性能Test ConditionTest MethodTest Result
玻璃转化温度>100 °C
线性热膨胀系数MD:--32.8E-05 cm/cm/°C
线性热膨胀系数MD:--45.7E-05 cm/cm/°C
线形热膨胀系数MD:导热系数>2.8 W/m/K
热固性Test ConditionTest MethodTest Result
贮藏期限23°C52 wk
后固化时间285°C1.5 hr
DryTime7.0 day
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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