PI, TS P1011S

0
  • Properties:
    Filler
    silver
  • Usages:
    Adhesive
    electrical
    and electronic application fields

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
ColorSilver
density2.43 g/cm³
Viscosity6.5to11 Pa·s
Curing Time<0.50 hr
Curing Time1.0 hr
physical property Test ConditionTest MethodTest Result
Particle size<20.0 µm
thermosettingTest ConditionTest MethodTest Result
shelf-life52 wk
Post curing time1.5 hr
drying time7.0 day
Cured PropertiesTest ConditionTest MethodTest Result
Shore hardness71
Volume resistivity<5.0E-4 ohms·cm
Supplementary InformationTest ConditionTest MethodTest Result
weight loss on heating0.080 %
weight loss on heating0.090 %
weight loss on heating0.16 %
DegradationTemperatureTGA379 °C
Shear Strength9.38 MPa
operate temperature-55-225 °C
operate temperature-55-325 °C
operate temperature4.41 GPa
operate temperature1.80
Thermal performanceTest ConditionTest MethodTest Result
Glass Transition Temperature>100 °C
Linear coefficient of thermal expansion2.8E-05 cm/cm/°C
Linear coefficient of thermal expansion5.7E-05 cm/cm/°C
Linear coefficient of thermal expansion>2.8 W/m/K
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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