
Epoxy EPO-TEK® OG116-31 Epoxy Technology Inc.
Typical Applications:
pcb LCD Application Adhesive Electrical Electronic Application Fields Medical Nursing Supplies
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | pcb | LCD | Application | Adhesive | Electrical | Electronic Application Fields | Medical | Nursing Supplies |
Certificates
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Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Shore hardness | ShoreD | 83 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| Color | White | |||
| density | 1.20 | g/cm³ | ||
| viscosity | 23°C | 20to30 | Pa·s | |
| optical performance | Test Condition | Test Method | Test Result | Test Unit |
| Refractive index | --5 | 1.567 | ||
| --6 | 1.584 | |||
| transmissivity | 500nm | >92.0 | % | |
| 660to1640nm | >96.0 | % | ||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| shelf-life | 23°C | 52 | wk | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Glass transition temperature | >115 | °C | ||
| Linear coefficient of thermal expansion | MD:--3 | 4.1E-05 | cm/cm/°C | |
| MD:--4 | 1.7E-04 | cm/cm/°C | ||
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Particle size distribution | <20.0 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| operate temperature | Intermittent | -55-300 | °C | |
| StorageModulus | 1.82 | GPa | ||
| ThixotropicIndex | 1.30 | |||
| weight loss on heating | 200°C | 0.31 | % | |
| 250°C | 0.68 | % | ||
| 300°C | 1.2 | % | ||
| DegradationTemperature | 409 | °C | ||
| Shear Strength | 23°C | 23.4 | MPa | |
| operate temperature | Continuous | -55-200 | °C |
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