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Epoxy EPO-TEK® 930-1 Epoxy Technology Inc.

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    Optical applications electrical and electronic applications
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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest Result
Volume resistivity23°C>1.0E+13 ohms·cm
Dissipation factor1kHz4E-03
Shore hardnessShoreD82
LapShearStrength23°C11.3 MPa
Relative permittivity1kHz3.99
Uncured PropertiesTest ConditionTest MethodTest Result
density固化时间(150°C)1.0 hr
densityPot Life1400 min
densityPartB1.03 g/cm³
densityPartA1.40 g/cm³
density粘度7(23°C)60to80 Pa·s
Color--5Amber
Color--6White
thermosettingTest ConditionTest MethodTest Result
Thermosetting components按重量计算的混合比100
Thermosetting componentsShelf Life(23°C)52 wk
Thermosetting componentsPartB按重量计算的混合比:4.0
thermal performanceTest ConditionTest MethodTest Result
Glass transition temperature>70.0 °C
Linear coefficient of thermal expansionMD:--32.8E-05 cm/cm/°C
Linear coefficient of thermal expansionMD:--49.6E-05 cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数1.1 W/m/K
Physical propertiesTest ConditionTest MethodTest Result
Particle size distribution<20.0 µm
Supplementary InformationTest ConditionTest MethodTest Result
DegradationTemperature415 °C
Shear Strength23°C23.4 MPa
operate temperatureContinuous-55-200 °C
operate temperatureIntermittent-55-300 °C
operate temperatureStorageModulus(23°C)5.47 GPa
operate temperatureThixotropicIndex3.80
weight loss on heating200°C0.090 %
weight loss on heating250°C0.50 %
weight loss on heating300°C1.3 %
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.