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Epoxy EK1000-MP Epoxy Technology Inc.

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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD66
LapShearStrength23°C6.96MPa
Volume resistivity<9.0E-5ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorSilver
density3.33g/cm³
viscosity23°C1.8to3.6Pa·s
Curing time200°C1.0hr
storage stability20000min
thermosettingTest ConditionTest MethodTest ResultTest Unit
drying time<1.0day
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>80.0°C
Linear coefficient of thermal expansionMD:--33.8E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--49.4E-05cm/cm/°C
thermal conductivity--513W/m/K
thermal conductivity--626W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<45.0µm
Ionic typeCl-<200ppm
Ionic typeK+<50ppm
Ionic typeNa+<50ppm
Ionic typeNH4+5ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C1.7%
DegradationTemperature357°C
Shear Strength>10kg:23°C723.4MPa
Shear Strength>5kg:23°C811.7MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus1.89GPa
operate temperatureThixotropicIndex3.60
weight loss on heating200°C0.19%
weight loss on heating250°C0.94%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.