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Epoxy H74F Epoxy Technology Inc.

Product Description
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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Dissipation factor1kHz0.012
Volume resistivity23°C>5.0E+13ohms·cm
Relative permittivity1kHz4.90
LapShearStrength23°C>13.8MPa
Shore hardnessShoreD88
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Color--5Amber
densityPot Life180min
Color--6Grey
densityPartB1.02g/cm³
densityPartA2.01g/cm³
density粘度7(23°C)45to75Pa·s
density固化时间(150°C)1.0hr
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsShelf Life(23°C)52wk
Thermosetting componentsPartB按重量计算的混合比:4.0
Thermosetting components按重量计算的混合比100
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数0.52W/m/K
Linear coefficient of thermal expansionMD:--41.1E-04cm/cm/°C
Linear coefficient of thermal expansionMD:--33.3E-05cm/cm/°C
Glass transition temperature>90.0°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeCl-41ppm
Ionic typeK+9ppm
Ionic typeNa+20ppm
Ionic typeNH4+100ppm
Particle size distribution<20.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
operate temperatureStorageModulus(23°C)4.40GPa
operate temperatureIntermittent-55-350°C
operate temperatureContinuous-55-250°C
Shear Strength23°C35.2MPa
DegradationTemperature486°C
weight loss on heating300°C0.10%
weight loss on heating250°C0.050%
weight loss on heating200°C0.050%
operate temperatureThixotropicIndex1.90
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.